3D printed assembly and software development for silicon photonics sensor device measurement

© 2020 SPIE. We developed an economical assembly for a silicon photonics resonator device including a device mount and lensed fiber holders for input and output fibers. The parts are fabricated by 3D printing technology using resin with digital light processing (DLP) technique and cured with UV ligh...

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Main Authors: N. Ittipratheep, S. Udomsom, U. Mankong, P. Chamsuk, A. Bouthwong, W. Anukool, T. Umezawa, A. Matsumoto
Format: Conference Proceeding
Published: 2020
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Online Access:https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85082721714&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/70454
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Institution: Chiang Mai University
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spelling th-cmuir.6653943832-704542020-10-14T08:40:24Z 3D printed assembly and software development for silicon photonics sensor device measurement N. Ittipratheep S. Udomsom U. Mankong P. Chamsuk A. Bouthwong W. Anukool T. Umezawa A. Matsumoto Computer Science Engineering Materials Science Mathematics © 2020 SPIE. We developed an economical assembly for a silicon photonics resonator device including a device mount and lensed fiber holders for input and output fibers. The parts are fabricated by 3D printing technology using resin with digital light processing (DLP) technique and cured with UV light (405nm). The lensed fibers are aligned to the device waveguides using 6-axis aligner platform and their holders are affixed to the device mount by UV glue. Our in-house assembly module is able to firmly affix the fiber holders to the device mount and align the input and output lens fibers to the device spot size converter (SSC) of dimension 3.4 × 3.5 μm2. After alignment completion, the assembly can be detached from the aligner stage to be used in un-stabilized benchtop measurement system. The benchtop measurement system for the silicon photonic sensor device consists of a tunable laser, a polarizer, an optical power meter, and a container housing the device assembly, peristalsis pump and control circuits that was developed inhouse for microfluidics control having flow rate in the level of nanoliter/minute. In addition, a software has been developed for the measurement of the device resonant wavelength and wavelength shift due to sensor activity. We have demonstrated that the silicon photonics resonator that has been mounted on our assembly in the above measurement system showed acceptable performance by comparing the results with those obtained by mounting the device on stabilized fiber alignment platform. Thus, the 3D printed assembly may be used for silicon photonics device mount in early portable sensor prototype development. 2020-10-14T08:31:10Z 2020-10-14T08:31:10Z 2020-01-01 Conference Proceeding 1996756X 0277786X 2-s2.0-85082721714 10.1117/12.2553021 https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85082721714&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/70454
institution Chiang Mai University
building Chiang Mai University Library
continent Asia
country Thailand
Thailand
content_provider Chiang Mai University Library
collection CMU Intellectual Repository
topic Computer Science
Engineering
Materials Science
Mathematics
spellingShingle Computer Science
Engineering
Materials Science
Mathematics
N. Ittipratheep
S. Udomsom
U. Mankong
P. Chamsuk
A. Bouthwong
W. Anukool
T. Umezawa
A. Matsumoto
3D printed assembly and software development for silicon photonics sensor device measurement
description © 2020 SPIE. We developed an economical assembly for a silicon photonics resonator device including a device mount and lensed fiber holders for input and output fibers. The parts are fabricated by 3D printing technology using resin with digital light processing (DLP) technique and cured with UV light (405nm). The lensed fibers are aligned to the device waveguides using 6-axis aligner platform and their holders are affixed to the device mount by UV glue. Our in-house assembly module is able to firmly affix the fiber holders to the device mount and align the input and output lens fibers to the device spot size converter (SSC) of dimension 3.4 × 3.5 μm2. After alignment completion, the assembly can be detached from the aligner stage to be used in un-stabilized benchtop measurement system. The benchtop measurement system for the silicon photonic sensor device consists of a tunable laser, a polarizer, an optical power meter, and a container housing the device assembly, peristalsis pump and control circuits that was developed inhouse for microfluidics control having flow rate in the level of nanoliter/minute. In addition, a software has been developed for the measurement of the device resonant wavelength and wavelength shift due to sensor activity. We have demonstrated that the silicon photonics resonator that has been mounted on our assembly in the above measurement system showed acceptable performance by comparing the results with those obtained by mounting the device on stabilized fiber alignment platform. Thus, the 3D printed assembly may be used for silicon photonics device mount in early portable sensor prototype development.
format Conference Proceeding
author N. Ittipratheep
S. Udomsom
U. Mankong
P. Chamsuk
A. Bouthwong
W. Anukool
T. Umezawa
A. Matsumoto
author_facet N. Ittipratheep
S. Udomsom
U. Mankong
P. Chamsuk
A. Bouthwong
W. Anukool
T. Umezawa
A. Matsumoto
author_sort N. Ittipratheep
title 3D printed assembly and software development for silicon photonics sensor device measurement
title_short 3D printed assembly and software development for silicon photonics sensor device measurement
title_full 3D printed assembly and software development for silicon photonics sensor device measurement
title_fullStr 3D printed assembly and software development for silicon photonics sensor device measurement
title_full_unstemmed 3D printed assembly and software development for silicon photonics sensor device measurement
title_sort 3d printed assembly and software development for silicon photonics sensor device measurement
publishDate 2020
url https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85082721714&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/70454
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