Numerical Validation of Heat Conduction in 2D Binary Granular Mixtures under Mechanical Loading

• Main Authors: K. Jongchansitto, P. Jongchansitto, I. Preechawuttipong
• 格式: Conference Proceeding
• 出版: 2020
• 主題: Engineering; Materials Science
• 在線閱讀: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85090289027&origin=inward; http://cmuir.cmu.ac.th/jspui/handle/6653943832/70560

© Published under licence by IOP Publishing Ltd. This study set out to investigate numerical simulations of heat conduction to validate existing experimental results of two-dimensional binary granular mixtures subjected to mechanical loading. Data for this study were collected using molecular dynami...