Numerical Validation of Heat Conduction in 2D Binary Granular Mixtures under Mechanical Loading

Numerical Validation of Heat Conduction in 2D Binary Granular Mixtures under Mechanical Loading

© Published under licence by IOP Publishing Ltd. This study set out to investigate numerical simulations of heat conduction to validate existing experimental results of two-dimensional binary granular mixtures subjected to mechanical loading. Data for this study were collected using molecular dynami...

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書目詳細資料
Main Authors:	K. Jongchansitto, P. Jongchansitto, I. Preechawuttipong
格式:	Conference Proceeding
出版:	2020
主題:	Engineering Materials Science
在線閱讀:	https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85090289027&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/70560
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