Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection

by Hu, Xiao, Yang, Ying, Chen, Zhong, Chan, Yan Cheong, Xu, Sha
Published 2014

Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

by Zhu, Ze, Chan, Yan-Cheong, Chen, Zhong, Gan, Chee-Lip, Wu, Fengshun
Published 2019