Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

by Yang, Ying, Chen, Zhong, Hu, Xiao, Xu, Sha, Chan, Y. C.
Published 2014

Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection

by Hu, Xiao, Yang, Ying, Chen, Zhong, Chan, Yan Cheong, Xu, Sha
Published 2014