Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

by Chong, Leong Gan, Uda
Published 2014

Influence of shear strength on long term biased humidity reliability of Cu ball bonds

by Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Published 2015

Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging

by Chong, Leong Gan, Uda, Hashim, Prof. Dr.
Published 2014

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

by Chong, Leong Gan, Classe, Francis, Uda, Hashim, Prof. Dr.
Published 2014

Extended reliability of gold and copper ball bonds in microelectronic packaging

by Chong, Leong Gan, Classe, Francis, Bak, Lee Chan, Uda, Hashim, Prof. Dr.
Published 2014

Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging

by Chong, Leong Gan, E., K. Ng, Bak, Lee Chan, Classe, Francis, Kwuanjai, T., Uda, Hashim, Prof. Dr.
Published 2014