Technical barriers and development of Cu wirebonding in nanoelectronics device packaging

by C., L. Gan, E., K. Ng, B., L. Chan, Uda, Hashim, Prof. Dr., F., C. Classe
Published 2013

Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging

by Chong, Leong Gan, E., K. Ng, Bak, Lee Chan, Classe, Francis, Kwuanjai, T., Uda, Hashim, Prof. Dr.
Published 2014