Bump height at low temperature analysis

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Steven, Taniselass
Published 2014

5mm × 5mm sized slug on high power LED stress and junction temperature analysis

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Vairavan, Rajendaran, Nazuhusna, Khalid
Published 2014

Relationship between controllable process parameters on bump height in ENIG

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Muhamad Hafiz,  Ab Aziz
Published 2014

Shear speed analysis on Sn-3.9Ag-0.6Cu Solder

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Ong, Tee Say, Vairavan, Rajendaran
Published 2014

Aluminium surface grain size analysis on RIE treatment

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Palianysamy, Moganraj, Aaron, Koay Terr Yeow
Published 2014