Main effects study on plasma etched aluminium metallization

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow
Published 2014

Surface roughness analysis on reactive ion etched aluminium deposited wafer

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow
Published 2014

Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Wei Wei, Ng
Published 2014

Surface roughness and wettability correlation on etched platinum using reactive ion ecthing

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Goh, Siew Chui, Khairul Anwar, Mohamad Khazali, Nooraihan, Abdullah
Published 2014

Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Siew Chui, Goh, Khairul Anwar, Mohamad Khazali, Nooraihan, Abdullah
Published 2014

Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Siew Chui, Goh, Khairul Anwar, Mohamad Khazali, Nooraihan, Abdullah
Published 2014

Aluminium surface grain size analysis on RIE treatment

by Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Palianysamy, Moganraj, Aaron, Koay Terr Yeow
Published 2014

Wettability and surface roughness study on RIE treated aluminium deposited surface

by Retnasamy, Vithyacharan, Zaliman, Sauli, Dr., Uda, Hashim, Prof. Dr., Palianysamy, Moganraj, Aaron, Koay Terr Yeow, Ramzan, Mat Ayub
Published 2015

Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous

by Retnasamy, Vithyacharan, Zaliman, Sauli, Dr., Aaron, Koay Terr Yeow, Goh, Siew Chui, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Published 2014