Long range nondestructive testing of honeycomb structures

by Guo, Ningqun, Lim, Mong King
Published 2008

Dynamic characteristics of ultrasonic wire bonders

by Guo, Ningqun., Ling, Shih Fu.
Published 2008

Active vibration control of printing circuit boards using piezoelectric bimorphs

by Guo, Ningqun., Yu, Jiun Der.
Published 2008

Nondestructive evaluation interfaces defects IC packaging

by Guo, Ningqun., Ling, Shih Fu., Wong, Brian Stephen.
Published 2008

Characterisation of defects in composite materials using ultrasonic testing

by Hing, Peter., Tan, Kha Sheng., Tui, Chen Guan., Guo, Ningqun., Wong, Brian Stephen.
Published 2008

Studies on smart materials and material systems for mechanical applications

by Yi, Sung, Boey, Freddy Yin Chiang, Guo, Ningqun, Lin, R. M., Ling, S. F., Shu, Dong Wei, Tan, M. J., Yue, Chee Yoon, M. F. Ahmad, Hilton, H. H., Sze, K. Y., Vinson, J. R.
Published 2008

Development of a data acquisition system for plate waves testing

by Han, Dingzhi
Published 2009

Characterization of PVDF hollow fiber membrane

by Lau, Xiang Ling.
Published 2009

Characterisation of PES hollow fibre membranes

by Fang, Rongquan
Published 2009

Simulation of lamb wave in composite for structural health monitoring

by Ge, Yao.
Published 2009

Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages

by Abdul Jaleel B. Shahul Hamid
Published 2008

Dynamic characteristics of the wire bonding process in electronic packaging

by Hu, Changmin.
Published 2008

Ultrasonic characterisation of interfaces in IC packaging

by Wang, Yi
Published 2008

Development of vibration modeling, testing and control techniques for hard disk drives

by Xu, Limei.
Published 2008

Applications of automated defects recognition in IC packaging based on ultrasound C-SAM images

by Zhang, Yilu.
Published 2008

Design and optimization of ultrasonic array transducers for medical imaging applications

by Wang, Qiong Bo
Published 2008

Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages

by Yeo, Hwee Chung.
Published 2008