Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Theses and Dissertations |
| 出版: |
2008
|
| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/5673 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | Nanyang Technological University |