Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages

This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.

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Bibliographic Details
Main Author:	Abdul Jaleel B. Shahul Hamid
Other Authors:	Guo, Ningqun
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5673
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5673
record_format	dspace
spelling	sg-ntu-dr.10356-56732023-03-11T16:54:04Z Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages Abdul Jaleel B. Shahul Hamid Guo, Ningqun School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves. Master of Engineering (MPE) 2008-09-17T10:56:20Z 2008-09-17T10:56:20Z 2001 2001 Thesis http://hdl.handle.net/10356/5673 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Abdul Jaleel B. Shahul Hamid Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
description	This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.
author2	Guo, Ningqun
author_facet	Guo, Ningqun Abdul Jaleel B. Shahul Hamid
format	Theses and Dissertations
author	Abdul Jaleel B. Shahul Hamid
author_sort	Abdul Jaleel B. Shahul Hamid
title	Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
title_short	Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
title_full	Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
title_fullStr	Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
title_full_unstemmed	Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
title_sort	ultrasonic evaluation of silicon/adhesive/copper interfaces in ic packages
publishDate	2008
url	http://hdl.handle.net/10356/5673
_version_	1761781590716841984

Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages

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