Fabrication and characterization of through silicon via interconnects for 3D IC packages
The advancement in technology and higher standards of living has brought along an increasing demand for higher performance microelectronic devices. Through Wafer Interconnect (TWI) technology is responsible for fabricating the future three dimensional Integrated circuit packaging that offers higher...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project |
| Language: | English |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/16870 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |