Fabrication and characterization of through silicon via interconnects for 3D IC packages

• Main Author: Huang, Weiqin.
• Other Authors: Miao Jianmin
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/16870
• Institution: Nanyang Technological University

The advancement in technology and higher standards of living has brought along an increasing demand for higher performance microelectronic devices. Through Wafer Interconnect (TWI) technology is responsible for fabricating the future three dimensional Integrated circuit packaging that offers higher...