Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5673 |
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| Institution: | Nanyang Technological University |