Failure analysis of tamper resistant materials for IC packaging

In recent years, the surge in counterfeit products in the microelectronics industry has escalated to problems such as losses and damages of companies’ reputation and consumers’ safety and confidence. With the aim to protect products and devices from attackers to obtain their circuit design, intellec...

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Bibliographic Details
Main Author: Siah, Yu Wen
Other Authors: Gan Chee Lip
Format: Theses and Dissertations
Language:English
Published: 2019
Subjects:
Online Access:https://hdl.handle.net/10356/104717
http://hdl.handle.net/10220/48618
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Institution: Nanyang Technological University
Language: English