Failure analysis of tamper resistant materials for IC packaging

• Main Author: Siah, Yu Wen
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2019
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/104717; http://hdl.handle.net/10220/48618
• Institution: Nanyang Technological University

In recent years, the surge in counterfeit products in the microelectronics industry has escalated to problems such as losses and damages of companies’ reputation and consumers’ safety and confidence. With the aim to protect products and devices from attackers to obtain their circuit design, intellec...