Optimisation of silicon adhesive cure using differential scanning calorimetry analysis

• المؤلف الرئيسي: Lee, Chow Sim.
• مؤلفون آخرون: Boey, Freddy Yin Chiang
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing::Product engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/13488
• المؤسسة: Nanyang Technological University

Polymer curing is an essential part of electronic manufacturing process. Most electronic components are sensitive to prolong heat exposure and has negative performance impact. Often, non-value-added time is wasted in post-cooling the part to acceptable temperature before the next process. Thus, the...