Feasibility study of a quick cure process using a conventional belt furnace

• المؤلف الرئيسي: Kwan, Yew Kee.
• مؤلفون آخرون: Boey, Freddy Yin Chiang
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Manufacturing::Product engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/20004
• المؤسسة: Nanyang Technological University

Over the years, die attach of cerdip packages had transformed from eutectic die bonding to silver glass die attach. But this material had a drawback. It had to be cured in a furnace at a temperature >400°C and its cycle time was generally about an hour. For optimal cure, the furnace profile was c...