Feasibility study of a quick cure process using a conventional belt furnace
Over the years, die attach of cerdip packages had transformed from eutectic die bonding to silver glass die attach. But this material had a drawback. It had to be cured in a furnace at a temperature >400°C and its cycle time was generally about an hour. For optimal cure, the furnace profile was c...
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Main Author: | Kwan, Yew Kee. |
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Other Authors: | Boey, Freddy Yin Chiang |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2009
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/20004 |
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Institution: | Nanyang Technological University |
Language: | English |
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