Feasibility study of a quick cure process using a conventional belt furnace

Over the years, die attach of cerdip packages had transformed from eutectic die bonding to silver glass die attach. But this material had a drawback. It had to be cured in a furnace at a temperature >400°C and its cycle time was generally about an hour. For optimal cure, the furnace profile was c...

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Bibliographic Details
Main Author: Kwan, Yew Kee.
Other Authors: Boey, Freddy Yin Chiang
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/20004
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Institution: Nanyang Technological University
Language: English

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