Development of a chip-on-tape encapsulation process

• Main Author: Mui, Yew Cheong.
• Other Authors: Tan, Soo Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Manufacturing::Product engineering
• Online Access: http://hdl.handle.net/10356/20541
• Institution: Nanyang Technological University

This thesis summarizes the work conducted in an effort to develop an encapsulation process for a chip-on-tape package. The various studies conducted included encapsulation material selection, encapsulation process studies and optimization and FEA simulations for the prediction of package performance...