Modelling of microwave curing process for flip chip underfill materials
Smaller-faster-cheaper electronic devices have driven the packaging industry. Now the packaging technology thrusts the industry into chip-sale abnd chip-size packaging. The ultimate destination appears to be package-less components such as the flip chip.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6054 |
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| Institution: | Nanyang Technological University |