Modelling of microwave curing process for flip chip underfill materials
Smaller-faster-cheaper electronic devices have driven the packaging industry. Now the packaging technology thrusts the industry into chip-sale abnd chip-size packaging. The ultimate destination appears to be package-less components such as the flip chip.
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2008
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sg-ntu-dr.10356-60542023-03-11T16:57:04Z Modelling of microwave curing process for flip chip underfill materials Liu, Lie. Ong, Lin Seng School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Smaller-faster-cheaper electronic devices have driven the packaging industry. Now the packaging technology thrusts the industry into chip-sale abnd chip-size packaging. The ultimate destination appears to be package-less components such as the flip chip. Doctor of Philosophy (MPE) 2008-09-17T11:05:44Z 2008-09-17T11:05:44Z 2003 2003 Thesis http://hdl.handle.net/10356/6054 Nanyang Technological University application/pdf |
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Nanyang Technological University |
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NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
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| topic |
DRNTU::Engineering::Manufacturing |
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DRNTU::Engineering::Manufacturing Liu, Lie. Modelling of microwave curing process for flip chip underfill materials |
| description |
Smaller-faster-cheaper electronic devices have driven the packaging industry. Now the packaging technology thrusts the industry into chip-sale abnd chip-size packaging. The ultimate destination appears to be package-less components such as the flip chip. |
| author2 |
Ong, Lin Seng |
| author_facet |
Ong, Lin Seng Liu, Lie. |
| format |
Theses and Dissertations |
| author |
Liu, Lie. |
| author_sort |
Liu, Lie. |
| title |
Modelling of microwave curing process for flip chip underfill materials |
| title_short |
Modelling of microwave curing process for flip chip underfill materials |
| title_full |
Modelling of microwave curing process for flip chip underfill materials |
| title_fullStr |
Modelling of microwave curing process for flip chip underfill materials |
| title_full_unstemmed |
Modelling of microwave curing process for flip chip underfill materials |
| title_sort |
modelling of microwave curing process for flip chip underfill materials |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/6054 |
| _version_ |
1761781461887746048 |