A Window clamp mechanism design for thermosonic gold wire bonding
In the semi-conductor packaging industry, integrated circuits (ICs) are packaged by a series of assembly processes. Among these assembly processes, wire bonding is the one demanding the highest precision. The purpose of wire bonding is to connect the ICs to the circuitry of the substrate and then to...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/20538 |
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| Institution: | Nanyang Technological University |
| Language: | English |