A Window clamp mechanism design for thermosonic gold wire bonding
In the semi-conductor packaging industry, integrated circuits (ICs) are packaged by a series of assembly processes. Among these assembly processes, wire bonding is the one demanding the highest precision. The purpose of wire bonding is to connect the ICs to the circuitry of the substrate and then to...
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sg-ntu-dr.10356-205382020-09-26T22:14:03Z A Window clamp mechanism design for thermosonic gold wire bonding Kwan, Ka Shing. Chang, Yu Chung James Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing::Product engineering In the semi-conductor packaging industry, integrated circuits (ICs) are packaged by a series of assembly processes. Among these assembly processes, wire bonding is the one demanding the highest precision. The purpose of wire bonding is to connect the ICs to the circuitry of the substrate and then to the outside world. At present, thermosonic bonding is one of the most commonly used methods for gold wire bonding between ICs and the metal lead frame fingers. In this process, the silicon die and the lead frame fingers on a bonding unit is heated up. Then, gold wires are welded to the metallic coated pads and then to the lead frame fingers with the combination of ultrasonic energy and thermal energy. Master of Science (Precision Engineering) 2009-12-15T03:17:29Z 2009-12-15T03:17:29Z 1996 1996 Thesis http://hdl.handle.net/10356/20538 en NANYANG TECHNOLOGICAL UNIVERSITY 131 p. application/pdf |
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DRNTU::Engineering::Manufacturing::Product engineering Kwan, Ka Shing. A Window clamp mechanism design for thermosonic gold wire bonding |
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In the semi-conductor packaging industry, integrated circuits (ICs) are packaged by a series of assembly processes. Among these assembly processes, wire bonding is the one demanding the highest precision. The purpose of wire bonding is to connect the ICs to the circuitry of the substrate and then to the outside world. At present, thermosonic bonding is one of the most commonly used methods for gold wire bonding between ICs and the metal lead frame fingers. In this process, the silicon die and the lead frame fingers on a bonding unit is heated up. Then, gold wires are welded to the metallic coated pads and then to the lead frame fingers with the combination of ultrasonic energy and thermal energy. |
author2 |
Chang, Yu Chung James |
author_facet |
Chang, Yu Chung James Kwan, Ka Shing. |
format |
Theses and Dissertations |
author |
Kwan, Ka Shing. |
author_sort |
Kwan, Ka Shing. |
title |
A Window clamp mechanism design for thermosonic gold wire bonding |
title_short |
A Window clamp mechanism design for thermosonic gold wire bonding |
title_full |
A Window clamp mechanism design for thermosonic gold wire bonding |
title_fullStr |
A Window clamp mechanism design for thermosonic gold wire bonding |
title_full_unstemmed |
A Window clamp mechanism design for thermosonic gold wire bonding |
title_sort |
window clamp mechanism design for thermosonic gold wire bonding |
publishDate |
2009 |
url |
http://hdl.handle.net/10356/20538 |
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1681059033402834944 |