A Window clamp mechanism design for thermosonic gold wire bonding

In the semi-conductor packaging industry, integrated circuits (ICs) are packaged by a series of assembly processes. Among these assembly processes, wire bonding is the one demanding the highest precision. The purpose of wire bonding is to connect the ICs to the circuitry of the substrate and then to...

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Bibliographic Details
Main Author: Kwan, Ka Shing.
Other Authors: Chang, Yu Chung James
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/20538
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Institution: Nanyang Technological University
Language: English

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