Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization
Interface evolution caused by thermal aging under different temperatures and durations was investigated by means of scanning electron microscopy (SEM) and transmission electron microscopy (TEM). It was found that approximately 30-nm-thick and discontinuous Cu-Al intermetallic compounds (IMCs) were p...
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2013
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| Online Access: | https://hdl.handle.net/10356/97042 http://hdl.handle.net/10220/10435 |
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| Institution: | Nanyang Technological University |
| Language: | English |