A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

• المؤلفون الرئيسيون: Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., Pramana, S. S., White, Timothy John, Chen, Z.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/95669; http://hdl.handle.net/10220/8243

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm...