A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

• Main Authors: Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., Pramana, S. S., White, Timothy John, Chen, Z.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/95669; http://hdl.handle.net/10220/8243
• Institution: Nanyang Technological University

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm...