Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution

• Main Authors: Xu, Hui, Liu, Changqing, Chen, Z., Wei, J., Sivakumar, M., Silberschmidt, Vadim V.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/79549; http://hdl.handle.net/10220/8242
• Institution: Nanyang Technological University

The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a lo...