A micromechanism study of thermosonic gold wire bonding on aluminium pad

• Main Authors: Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., Pramana, S. S., White, Timothy John, Chen, Z., Sivakumar, M., Acoff, V. L.
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2012
• 主題: DRNTU::Engineering::Materials
• 在線閱讀: https://hdl.handle.net/10356/94156; http://hdl.handle.net/10220/7694

A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial characteristics as a result of the bonding process, including the fragmentation of the native aluminum oxide layer on Al pads, and formation of initial intermetallic compounds...