A micromechanism study of thermosonic gold wire bonding on aluminium pad
A micromechanism of thermosonic gold wire bonding was elaborated by examining its interfacial characteristics as a result of the bonding process, including the fragmentation of the native aluminum oxide layer on Al pads, and formation of initial intermetallic compounds...
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Main Authors: | Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., Pramana, S. S., White, Timothy John, Chen, Z., Sivakumar, M., Acoff, V. L. |
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Other Authors: | School of Materials Science & Engineering |
Format: | Article |
Language: | English |
Published: |
2012
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/94156 http://hdl.handle.net/10220/7694 |
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Institution: | Nanyang Technological University |
Language: | English |
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