Failure analysis of bond pad metal peeling using FIB and AFM

Aluminum bond pads on semiconductor chips play an important role in chips functionality and reliability. Bond pad peeling during wire bonding process results in yield reduction. The failure mechanisms of the peeling must be identified so that potential reliability problem of poor bond pad adhesion c...

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Bibliographic Details
Main Authors: Tan, Cher Ming, Er, Eddie, Hua, Younan, Chai, Vincent Siew Heong
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/91599
http://hdl.handle.net/10220/4656
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Institution: Nanyang Technological University
Language: English