Failure analysis of bond pad metal peeling using FIB and AFM

Aluminum bond pads on semiconductor chips play an important role in chips functionality and reliability. Bond pad peeling during wire bonding process results in yield reduction. The failure mechanisms of the peeling must be identified so that potential reliability problem of poor bond pad adhesion c...

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Main Authors:	Tan, Cher Ming, Er, Eddie, Hua, Younan, Chai, Vincent Siew Heong
Other Authors:	School of Electrical and Electronic Engineering
Format:	Article
Language:	English
Published:	2009
Subjects:	DRNTU::Engineering::Electrical and electronic engineering
Online Access:	https://hdl.handle.net/10356/91599 http://hdl.handle.net/10220/4656
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Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-91599
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spelling	sg-ntu-dr.10356-915992020-03-07T14:02:41Z Failure analysis of bond pad metal peeling using FIB and AFM Tan, Cher Ming Er, Eddie Hua, Younan Chai, Vincent Siew Heong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Aluminum bond pads on semiconductor chips play an important role in chips functionality and reliability. Bond pad peeling during wire bonding process results in yield reduction. The failure mechanisms of the peeling must be identified so that potential reliability problem of poor bond pad adhesion can be avoided. In this work, FIB, SEM, EDX, and AFM are used to identify the root causes of the peeling. The possible root causes are found to be the presence of an extra layer of thickness of 0.14 µm and the poly-silicon surface roughness asperity due to prolonged BOE etching time. Published version 2009-06-23T03:21:38Z 2019-12-06T18:08:40Z 2009-06-23T03:21:38Z 2019-12-06T18:08:40Z 1998 1998 Journal Article Tan, C. M., Er, E., Hua, Y., & Chai, V. (1998). Failure analysis of bond pad metal peeling using FIB and AFM.IEEE Transactions on Components, Packaging, And Manufacturing Technology-Part A, 21(4), 585-591. 1070-9886 https://hdl.handle.net/10356/91599 http://hdl.handle.net/10220/4656 10.1109/95.740049 en IEEE transactions on components, packaging, and manufacturing technology-part A © 1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site. 7 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Electrical and electronic engineering
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering Tan, Cher Ming Er, Eddie Hua, Younan Chai, Vincent Siew Heong Failure analysis of bond pad metal peeling using FIB and AFM
description	Aluminum bond pads on semiconductor chips play an important role in chips functionality and reliability. Bond pad peeling during wire bonding process results in yield reduction. The failure mechanisms of the peeling must be identified so that potential reliability problem of poor bond pad adhesion can be avoided. In this work, FIB, SEM, EDX, and AFM are used to identify the root causes of the peeling. The possible root causes are found to be the presence of an extra layer of thickness of 0.14 µm and the poly-silicon surface roughness asperity due to prolonged BOE etching time.
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Tan, Cher Ming Er, Eddie Hua, Younan Chai, Vincent Siew Heong
format	Article
author	Tan, Cher Ming Er, Eddie Hua, Younan Chai, Vincent Siew Heong
author_sort	Tan, Cher Ming
title	Failure analysis of bond pad metal peeling using FIB and AFM
title_short	Failure analysis of bond pad metal peeling using FIB and AFM
title_full	Failure analysis of bond pad metal peeling using FIB and AFM
title_fullStr	Failure analysis of bond pad metal peeling using FIB and AFM
title_full_unstemmed	Failure analysis of bond pad metal peeling using FIB and AFM
title_sort	failure analysis of bond pad metal peeling using fib and afm
publishDate	2009
url	https://hdl.handle.net/10356/91599 http://hdl.handle.net/10220/4656
_version_	1681041336801689600

Failure analysis of bond pad metal peeling using FIB and AFM

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