Failure analysis of bond pad metal peeling using FIB and AFM

• Main Authors: Tan, Cher Ming, Er, Eddie, Hua, Younan, Chai, Vincent Siew Heong
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/91599; http://hdl.handle.net/10220/4656
• Institution: Nanyang Technological University

Aluminum bond pads on semiconductor chips play an important role in chips functionality and reliability. Bond pad peeling during wire bonding process results in yield reduction. The failure mechanisms of the peeling must be identified so that potential reliability problem of poor bond pad adhesion c...