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Chai, Vincent Siew Heong
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Chai, Vincent Siew Heong
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Chai, Vincent Siew Heong
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1
Failure analysis of bond pad metal peeling using FIB and AFM
by
Tan, Cher Ming
,
Er, Eddie
,
Hua, Younan
,
Chai
,
Vincent
Siew
Heong
Published 2009
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2
Effect of BOE etching time on wire bonding quality
by
Tan, Cher Ming
,
Linggajaya, Kaufik
,
Er, Eddie
,
Chai
,
Vincent
Siew
Heong
Published 2009
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