Evaluation of wire bond integrity through force detected wire vibration analysis

10.1109/AIM.2009.5230047

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Bibliographic Details
Main Authors: Luo, H., Lu, Z., Nam, J.H., Chen, P.C.Y., Lin, W.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73443
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Institution: National University of Singapore