Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution
The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a lo...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/79549 http://hdl.handle.net/10220/8242 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for
bonding strength were investigated using high resolution transmission electron microscopy. It shows
that intermetallic compound crystallization correlates with bonding duration, as a longer duration is
applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust
bonds. In addition, a substrate temperature (i.e. 175 C) promotes the fracture of alumina, and simultaneously
contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation
of intermetallic compounds, therefore increasing bonding strength. The compound formed during
bonding is CuAl2, regardless of the bonding parameters applied. |
|---|