Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads : a TEM study of interfacial evolution

The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a lo...

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Bibliographic Details
Main Authors: Xu, Hui, Liu, Changqing, Chen, Z., Wei, J., Sivakumar, M., Silberschmidt, Vadim V.
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/79549
http://hdl.handle.net/10220/8242
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Institution: Nanyang Technological University
Language: English

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