Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

• Main Authors: Made, R.I., Gan, C.L., Lee, C., Yan, L., Yu, A., Yoon, S.W.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/70067
• Institution: National University of Singapore

10.1109/IPFA.2008.4588168