Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
10.1109/IPFA.2008.4588168
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Main Authors: | Made, R.I., Gan, C.L., Lee, C., Yan, L., Yu, A., Yoon, S.W. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/70067 |
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Institution: | National University of Singapore |
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