Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

10.1109/IPFA.2008.4588168

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書目詳細資料
Main Authors: Made, R.I., Gan, C.L., Lee, C., Yan, L., Yu, A., Yoon, S.W.
其他作者: ELECTRICAL & COMPUTER ENGINEERING
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/70067
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總結:10.1109/IPFA.2008.4588168

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