Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
10.1109/IPFA.2008.4588168
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sg-nus-scholar.10635-700672024-11-09T08:00:38Z Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds Made, R.I. Gan, C.L. Lee, C. Yan, L. Yu, A. Yoon, S.W. ELECTRICAL & COMPUTER ENGINEERING 10.1109/IPFA.2008.4588168 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA - 2014-06-19T03:07:50Z 2014-06-19T03:07:50Z 2008 Conference Paper Made, R.I.,Gan, C.L.,Lee, C.,Yan, L.,Yu, A.,Yoon, S.W. (2008). Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IPFA.2008.4588168" target="_blank">https://doi.org/10.1109/IPFA.2008.4588168</a> 1424420393 http://scholarbank.nus.edu.sg/handle/10635/70067 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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| description |
10.1109/IPFA.2008.4588168 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Made, R.I. Gan, C.L. Lee, C. Yan, L. Yu, A. Yoon, S.W. |
| format |
Conference or Workshop Item |
| author |
Made, R.I. Gan, C.L. Lee, C. Yan, L. Yu, A. Yoon, S.W. |
| spellingShingle |
Made, R.I. Gan, C.L. Lee, C. Yan, L. Yu, A. Yoon, S.W. Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds |
| author_sort |
Made, R.I. |
| title |
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds |
| title_short |
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds |
| title_full |
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds |
| title_fullStr |
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds |
| title_full_unstemmed |
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds |
| title_sort |
effect of bonding pressure on the bond strengths of low temperature ag-in bonds |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/70067 |
| _version_ |
1821219695986999296 |