Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

10.1109/IPFA.2008.4588168

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Main Authors: Made, R.I., Gan, C.L., Lee, C., Yan, L., Yu, A., Yoon, S.W.
其他作者: ELECTRICAL & COMPUTER ENGINEERING
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/70067
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機構: National University of Singapore
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spelling sg-nus-scholar.10635-700672024-11-09T08:00:38Z Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds Made, R.I. Gan, C.L. Lee, C. Yan, L. Yu, A. Yoon, S.W. ELECTRICAL & COMPUTER ENGINEERING 10.1109/IPFA.2008.4588168 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA - 2014-06-19T03:07:50Z 2014-06-19T03:07:50Z 2008 Conference Paper Made, R.I.,Gan, C.L.,Lee, C.,Yan, L.,Yu, A.,Yoon, S.W. (2008). Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IPFA.2008.4588168" target="_blank">https://doi.org/10.1109/IPFA.2008.4588168</a> 1424420393 http://scholarbank.nus.edu.sg/handle/10635/70067 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/IPFA.2008.4588168
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Made, R.I.
Gan, C.L.
Lee, C.
Yan, L.
Yu, A.
Yoon, S.W.
format Conference or Workshop Item
author Made, R.I.
Gan, C.L.
Lee, C.
Yan, L.
Yu, A.
Yoon, S.W.
spellingShingle Made, R.I.
Gan, C.L.
Lee, C.
Yan, L.
Yu, A.
Yoon, S.W.
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
author_sort Made, R.I.
title Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
title_short Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
title_full Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
title_fullStr Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
title_full_unstemmed Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
title_sort effect of bonding pressure on the bond strengths of low temperature ag-in bonds
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/70067
_version_ 1821219695986999296