Optimisation of silicon adhesive cure using differential scanning calorimetry analysis

• Main Author: Lee, Chow Sim.
• Other Authors: Boey, Freddy Yin Chiang
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing::Product engineering
• Online Access: http://hdl.handle.net/10356/13488
• Institution: Nanyang Technological University

Polymer curing is an essential part of electronic manufacturing process. Most electronic components are sensitive to prolong heat exposure and has negative performance impact. Often, non-value-added time is wasted in post-cooling the part to acceptable temperature before the next process. Thus, the...