Applications of multi-walled carbon nanotube in electronic packaging

由 Tan, Cher Ming, Baudot, Jacques Desire Charles, Han, Yongdian, Jing, Hongyang
出版 2013

Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth

由 Nai, S. M. L., Xu, L. Y., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun
出版 2010

Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling

由 Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
出版 2013

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

由 Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
出版 2013

Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints

由 Nai, S. M. L., Xu, L. Y., Wei, J., Jing, Hongyang, Tan, Cher Ming, Han, Yongdian
出版 2013

A new creep model for SnAgCu lead-free composite solders : incorporating back stress

由 Nai, S. M. L., Xu, L. Y., Zhang, S. R., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun
出版 2010