Applications of multi-walled carbon nanotube in electronic packaging

• Main Authors: Tan, Cher Ming, Baudot, Jacques Desire Charles, Han, Yongdian, Jing, Hongyang
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/95120; http://hdl.handle.net/10220/9225
• Institution: Nanyang Technological University

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them,...