Applications of multi-walled carbon nanotube in electronic packaging

• Main Authors: Tan, Cher Ming, Baudot, Jacques Desire Charles, Han, Yongdian, Jing, Hongyang
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/95120; http://hdl.handle.net/10220/9225
• Institution: Nanyang Technological University

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.