Applications of multi-walled carbon nanotube in electronic packaging

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them,...

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Bibliographic Details
Main Authors: Tan, Cher Ming, Baudot, Jacques Desire Charles, Han, Yongdian, Jing, Hongyang
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/95120
http://hdl.handle.net/10220/9225
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Institution: Nanyang Technological University
Language: English
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