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Harun, Fuaida
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Harun, Fuaida
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Harun, Fuaida
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1
Influence of Wafer Probing Against Initial Bonding
by
Suresh, Kumar
,
Sivarao, Subramonian
,
Guan, Tan Kim
,
Harun
,
Fuaida
Published 2010
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2
Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process
by
Mohd Noh, Mohd Syahrin Amri
,
Liew, David
,
Harun
,
Fuaida
Published 2010
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3
Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process
by
Mohd Noh, Mohd Syahrin Amri
,
Liew, David
,
Harun
,
Fuaida
Published 2010
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4
Solving eventual bonding quality to enhance adhesion for QFN packages
by
Suresh, Kumar
,
Subramonian, Sivarao
,
Cheong MT
,
Mohd Azmeer
,
Harun
,
Fuaida
Published 2010
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