Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process
Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English English |
| Published: |
IEEE Conference Publications
2010
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/5199/1/Syahrin_IEMT_2010.pdf http://eprints.utem.edu.my/id/eprint/5199/2/chipping_free_process.pdf http://eprints.utem.edu.my/id/eprint/5199/ https://ieeexplore.ieee.org/document/5746667 |
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| Institution: | Universiti Teknikal Malaysia Melaka |
| Language: | English English |